AI Inference and Edge Scenarios
Embedded Storage EC100
Key features: high reliability, high PE cycles, support for firmware update, support for HS400, support for HPI (high-priority interrupt), support for cache flush report and device health report.
| Model | EC100 Commercial Series | ||
|---|---|---|---|
| Capacity | 8GB~16GB | 64GB | 128GB~256GB |
| Interface | eMMC5.1 | ||
| Protocol | JESD84-B51 | ||
| Speed Mode | HS400 | ||
| NAND Type | pSLC | 3D TLC | 3D TLC |
| NAND Flash | Hynix V7 sPGD | Hynix V7 sPGD | Hynix V9 sPGD |
| Seq Read Performance | Up to 320MB/S | Up to 320MB/S | Up to 330MB/S |
| Seq Write Performance | Up to 260MB/S | Up to 260MB/S | Up to 270MB/S |
| Operating Voltage | Vcc: 2.7V~3.6V Vccq: 1.7V~1.95V / 2.7V~3.6V | ||
| Operating Temperature | -25℃~85℃ | ||
| Storage Temperature | -40℃~85℃ | ||
| Package | FBGA 153BALL | ||
| Size | 13mm*11.5mm*1.0mm | ||
| Customized | Support | ||
| Application | OTT / Wifi / Recording pen / Reading pen etc. | TV / Commercial monitor / Cloud pc etc. | Smartphone / Learning Tablet etc. |
Built with high-quality original wafers from tier-one manufacturers, the products deliver industry-leading write endurance, meeting the demand for long-term reliable operation under 24/7 high-intensity read/write workloads in scenarios including industrial control, automotive electronics, and security surveillance.
MTBF (Mean Time Between Failures) exceeds 1 million hours, fully meeting the reliability specification requirements for commercial-grade, industrial-grade and automotive-grade products.
The product strictly complies with the JEDEC eMMC 5.1 standard, natively supports the HS400 high-speed transmission mode, and adopts a standardized FBGA153 Ball hardware interface. It enables rapid integration and seamless compatibility with terminal devices, significantly reducing customers' R&D and debugging costs and improving mass production delivery efficiency.
